Principal Wireless SoC Architect (low power)

Michael Page · Neuchâtel

Michael Page seeks a Principal Wireless SoC Architect in Neuchâtel to lead the strategic design of ultra-low-power wireless systems. This on-site role requires extensive experience in RF CMOS and system-level architecture.

The company is looking for a senior technical leader to define the architecture for next-generation wireless systems. This position offers the chance to influence future product directions and drive the integration of hardware and software components across global engineering teams.

Responsibilities

  • Establish the complete system architecture for ultra-low-power wireless chips.
  • Determine how hardware and software responsibilities are divided at the system level.
  • Coordinate technical decisions among RF, analog, digital, firmware, packaging, and validation groups.
  • Balance system performance, energy efficiency, manufacturing costs, and reliability.
  • Manage the integration of the SoC, including package and printed circuit board aspects.
  • Help shape the long-term technology roadmap and product strategy.
  • Guide the product from initial requirements through validation and production qualification.
  • Serve as the final technical authority for architectural choices across international teams.

Requirements

  • Bachelor’s or higher degree in Electrical Engineering, Microelectronics, or Computer Engineering.
  • At least 15 years of professional experience in wireless SoC or RF CMOS design and architecture.
  • Demonstrated success in moving low-power RF SoCs from initial concept to mass production.
  • Strong knowledge of RF CMOS, wireless system architecture, SoC integration, mixed-signal design, power management, and system partitioning.
  • Deep understanding of power, performance, and area trade-offs in low-power semiconductor design.
  • Familiarity with wireless protocols such as Bluetooth Low Energy (BLE) or IEEE 802.15.4.

Nice to have

  • Experience with advanced semiconductor process nodes, specifically 22nm and below.

What the company offers

  • Work within a highly innovative international semiconductor environment.
  • Collaborate with multidisciplinary R&D teams located around the world.

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